CMOS faces new device and technology challenges: MOSFETs require ultra-sharp doping profiles and complex processing; integration of devices into circuits requires arbitrary interconnection with overlay precision beyond known manufacturing solutions (3σ=±3nm, 16nm CMOS, ITRS’11[1]). To overcome these challenges, we propose a new nanoscale computing fabric with integrated design of device, interconnect and circuits to minimize manufacturing requirements while providing ultra-dense, high-performance, and low-power solution surpassing scaled CMOS.